Chipset prepares for mobile TV
18 February 2008
SIDSA uses Toshiba’s chipset with CMOS ASIC process and embedded DRAM in its mobile TV chipset.
Electronics Europe has announced that its CMOS ASIC process and embedded DRAM (eDRAM) technology have played a key role in the development of a next-generation SoC DVB-H IC for mobile TV technology from SIDSA.
The Enter E1 SoC IC is a described as a fundamental element of SIDSA’s mobile TV reference designs, which bring new levels of mobile performance to a range of mobile and consumer electronics products for different mobile TV standards in frequency bands as high as 3GHz.
SIDSA, an audio-visual technology provider, worked closely with Toshiba’s ELDEC (European LSI design and engineering centre) to bring the IC to market. Important elements of the SoC design include a special dual low-power ADC to support the mobile TV application, an advanced embedded DRAM implementation, and techniques that minimise package size and power consumption.
The eDRAM allows the SoC to support reception of an unlimited number of DVB-H and DVB-T services as well as enabling the ARM application processor to run significant parts of the SIDSA DVB-H software stack. This frees up the host processor, reduces data transfer overheads and leads to a reduction in overall system power consumption.
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