Converters save portable space
18 March 2008
A chip scale packaging claims to reduce footprint, enhance performance and reduce manufacturing costs.
Converters with lower component profiles, reduced stray inductance, capacitance and resistance and enhanced electrical characteristics have been developed by AnalogicTech using chip scale packaging. The company claims that the reduced footprint, improved AC performance and reduced manufacturing costs will appeal to designers of portable consumer devices, such as mobile phones and Bluetooth headsets.
The chips scale package has been used on the AAT1149 and AAT1171 DC/DC converters to eliminate bond wires to reduce the footprint by up to 73 per cent. The packaging reduces noise compared to traditional packaging with bond wires and has reduced the footprint to 1.235mm x 0.91mm (AAT1149) and 1.5mm x 2.2mm (AAT1171). The former step-down converter delivers up to 400mA of load current from a 2.7V to 5.5V input while operating with low-profile, 1mm high 0603 inductors. Output voltage is programmable via external feedback resistors from 1V to VIN. Efficiency is up to 98 per cent. No-load quiescent current is 45µA.
The AAT1171 is a dynamic voltage-scaling DC/DC converter supporting power amplifiers in WCDMA and CDMA handsets. Power savings of up to 60 per cent are claimed, compared to connecting an amplifier directly to the system battery, increasing the talktime of the handset. It operates across 2.7V to 5.5V input and delivers up to 600mA continuous load current. Variable output is 0.6V to 3.6V and no-load quiescent current is just 45µA.
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