30V MOSFETs shrink footprint
02 September 2008
Direct FET MOSFETs shrink the SO-8 footprint by 40 per cent to save space in notebook computers.
The 30V DirectFET MOSFETs are the latest generation 30V HEXFET power MOSFET silicon and advanced DirectFET packaging technology from International Rectifier. They are optimised for synchronous buck converter designs for notebook computers, server CPU power, graphics and memory voltage regulator applications.
They are 40 per cent smaller than a standard SO-8 device, claims the company and have a slim profile of 0.7mm.
The devices have low on-state resistance while minimising gate charge and gate-to-drain charge for increased efficiency and thermal performance over the load, as well as ultra-low package inductance to reduce conduction and switching losses.
Operation is up to 25A/phase. The IRF6724M, IRF6725M, IRF6726M and IRF6727M have a common MT and MX footprint, allowing them to be used for migration where increased current levels or improved thermal performance is required.
They are available in SQ, ST and MP footprints.
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