EEPROM gets smaller
07 April 2009
Wafer-Level Chip Scale Packaging for 4, 65 and 128 Kbit serial EEPROMs.
Smaller form factors have forced engineers to consider smaller packages to meet the needs of their applications. With this in mind, several new I2C serial EEPROM devices in small packages were introduced by Microchip via distributor Rutronik. The devices complement industry trends toward smaller and more sophisticated designs, and are suitable for a range of portable and consumer applications. The devices are also appropriate for applications in the industrial market such as security cameras, as well as in medical applications such as glucose meters and hearing aids.
The series of 4, 64 and 128 Kbit serial EEPROMs come in a Wafer-Level Chip Scale Package (WLCSP). Additionally, Microchip introduced the industry’s first 1 and 2 Kbit I2C serial EEPROMs in a 5-pin SC-70 package, and the industry’s first 32 and 64 Kbit serial EEPROMs in a 5-pin SOT-23 package.
With Microchip’s serial EEPROMs, designers can replace larger packages with these smaller, less expensive packages without sacrificing performance. The die-sized WLCSP has a low profile, making it appropriate for space and height constrained applications. The low pin count of the small 2 mm x 2 mm SC-70 and 3 mm x 3 mm SOT-23 packages requires fewer I/O connectors, which helps to minimise overall design size and cost; and provides further cost advantages over other popular package types such as the SOIC.
With the WLCSP, Microchip now offers an entire family of I2C EEPROMs in packages the size of the die itself – several are smaller than 1 mm x 1 mm.
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