Shift from leaded resistors
22 June 2009
Power Metal Strip resistors for electronic controls in automotive systems feature 5 W power rating.
The industry’s first Power Metal Strip resistors to offer a 5 W power rating in the 4527 package size were unveiled by Vishay.
Like the WSR2 (2 W) and WSR3 (3 W), the new WSR5 measures just 0.455 in. x 0.275 in. [11.56 mm x 6.98 mm] with a height profile of 0.095 in. [2.41 mm], making it a compact 5 W solution for electronic controls in automotive systems, power supplies in communications base stations, and dc-to-dc converters and VRMs in high-end workstations and servers.
A proprietary processing technique allows the WSR5 to offer low resistance values ranging from 1 mΩ to 300 mΩ in a standard resistance tolerance of ±1%. A tolerance of ±0.5% is available for the resistance range of 10 mΩ to 300 mΩ. The WSR5's low inductance values range from 0.5 nH to 5 nH, and the device's temperature coefficients are ± 110 ppm/°C for the 7.5 mΩ to 9.9 mΩ range and ±75 ppm/°C for the 10 mΩ to 300 mΩ range.
The WSR5 resistor's proprietary construction features a molded, high-temperature encapsulation with an integrated heat sink for improved thermal management. As a result, the new device maintains the electrical characteristics of the Power Metal Strip construction during operation in a variety of high-current applications. Low thermal EMF, a broad operating temperature range of –65°C to +275°C, and resistance to moisture, vibration, thermal and mechanical shock ensure reliable operation. The WSR5's proprietary Power Metal Strip design features all-welded construction, solderable terminations, and a solid metal alloy resistive element.
The WSR5's high-power capability in a compact package enables designers to shift away from leaded resistors to a surface-mount solution, and thus to create smaller, lower-cost, and/or higher-performing end products. When used to replace through-hole current-sensing resistors, the WSR5 reduces manufacturing placement costs while allowing for total solder reflow assembly. Per-device costs also are further reduced by the elimination of secondary operations such as lead forming and trimming.
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