Improving test times of RF comms devices
23 October 2009
Aeroflex is to develop a customised PXI solution for production line test of Infineon mobile phone chips.
The company has announced that it will deliver a non-signalling PXI solution customised for RF production line test of Infineon’s second-generation ultra low-cost mobile phone platform. The solution, based on the Aeroflex PXI 3000 Series, will test Infineon’s second-generation ultra low-cost chipset (X-GOLD101).
The primary challenges facing mobile phone handset manufacturers today are getting to market first, lowering the cost of manufacturing test, and optimising valuable engineering resources. Aeroflex’s PXI accelerates the development of a customised RF test solution to meet these needs.
The key advantage of Aeroflex’s PXI solution is its flexibility, which contributes to lower test costs and faster test times. The PXI 3000 Series is able to test many more standards (such as WLAN, CMA2000/1xEVDO, WiMAX, UMTS, GSM/EDGE, Bluetooth and LTE) than previous one-box solutions could. This is important because today’s design engineers and manufacturers are developing sophisticated mobile phones that require cellular handset developers to test one device for compliance with many, if not all, of these standards.
With the PXI 3000 Series, the same flexible high-performance high-speed hardware tests all the 2G, 3G and 4G and wireless data standards. Furthermore, the user can add software modules to customise the solution to meet their current and future RF testing needs. The PXI 3000 Series achieves up to five times higher throughput than conventional instrumentation and is leading the market in terms of test speed. Its performance is the result of very fast responding hardware and the use of multi-core processors. Multi-core processing through the inherently open software architecture helps the engineer to perform multiple simultaneous measurements and multi-device testing.
“Our customers include the leading global mobile handset manufacturers and their supply chains. Their loyalty, as well as our strong partnerships with chipset manufacturers, demonstrate Aeroflex’s consistent track record of meeting and exceeding the most stringent market requirements,” said Bill Burrows, Business Development Manager at Aeroflex. “Our extensive expertise in design and manufacturing of RF systems is reflected in every PXI module, providing the highest levels of performance, accuracy, reliability and repeatability, which translates to our customers and partners as confidence in their test results.”
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