DualCool NexFET power MOSFETs
15 January 2010
TI unveils power MOSFETs with reduced top-side thermal impedance to cool high-current DC/DC apps.
Texas Instruments has introduced the industry’s first family of standard-footprint power MOSFETs that dissipate heat through the top of the package for high-current DC/DC applications.
DualCool NexFET power MOSFETs reduce end equipment size, while providing up to 50% more current through the MOSFET and improving thermal management over other standard-footprint packages.
This new family of five NexFET devices allows computing and telecom system designers to use higher current processors with expanded memory while saving board space. These MOSFETs in an advanced package can be used in a wide range of end applications including desktop personal computers, servers, telecommunications or networking equipment, basestations, and high current industrial systems.
“Our customers demand higher current DC/DC power supplies in a smaller footprint to meet the need for increased processing power in the broad infrastructure market,” said Steve Anderson, TI’s Senior Vice President and Worldwide Manager, Power Management. “DualCool NexFET power MOSFETs meet this need by conducting more current in the same form factor.”
Key features and benefits of DualCool NexFET power MOSFETs include:
• Single phase 35-A synchronous buck converter MOSFETs, using single MOSFETs for both the high and low side switches in high-current DC/DC applications.
• Enhanced packaging technology reduces thermal impedance to top of package from 10ºC to 15°C per watt to 1.2°C per watt, increasing power dissipation capability by up to 80%.
• Efficient dual-side heat sinking enables up to 50% more current through the FET, giving designers the flexibility to use higher current processors without increasing end equipment size.
• Industry-standard SON package with a 5mm x 6mm footprint eases design and keeps cost down, saving 30 mm2 compared to using two standard packages.
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