High Power Card Edge connector
09 March 2010
A manufacturer of connectors and interconnect systems has a High Power Card Edge (HPCE) connector.
This next generation power card edge connector from FCI is intended for applications demanding low power loss and high linear current density. The connector is rated to 9A per power contact beam (with multiple power contacts fully energised) without exceeding a 30°C temperature rise in still air.
The HPCE connector has a low profile height (<= 7.50mm) and is based on cost-effective and highly reliable stamped-and-formed power contact technology.
"The innovative power contact and housing designs deliver a more compact and lower profile package that is ideal for pluggable AC and DC power supplies or board-to-board connections for power distribution," said John Dodds, Global Power Product Manager at FCI. "These features make the HPCE connector an excellent choice for applications in next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment."
HPCE connectors are available with power and signal contacts integrated into a single moulded housing for power distribution and power control. The flexible, modular tooling approach used for the HPCE connector makes the product highly configurable in terms of the number and placement of the power and signal contacts for custom power needs.
The HPCE connector features a low profile height for increased system airflow and heat dissipation, low contact resistance characteristics, significantly increased linear current density, a robust housing with touch-proof safety features, and a polarisation option to ensure proper mating. Vertical and right-angle options are available to accommodate various system architectures.
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