Compact power amplifier modules
25 May 2010
Avago Technologies releases MultiMode 3x3 power amplifier modules.
The supplier of analogue interface components has announced the launch of ten new compact UMTS Power Amplifier Modules that maximise handset talk time and extend battery life. UMTS Bands 1, 2, 4, 5 and 8 are supported.
“In the ACPM-500x and the ACPM-520x series, we have incorporated our tier-one customer requirements for an integrated directional coupler, multi-mode power control, low current, and high PAE (power added efficiency),” said James Wilson, Marketing Director of Avago Technologies. “The directional coupler is a real cost saving feature for all handset makers, and the improved efficiency will give most users longer talk time.”
The ACPM-500x PAMs (Power Amplifier Modules) are designed to meet the requirements of MultiMode applications including UMTS (universal mobile telecommunication system), CDMA (code division multiple access) and LTE (long term evolution).
The ACPM-520x PAMs are optimised to maximise the PAE at maximum RF powers by adjusting maximum output powers. These modules are intended to meet UMTS specifications. With multiple product lines, customers have the flexibility to choose the right products for their application.
All of the PAMs benefit from Avago’s fifth generation CoolPAM technology that lowers quiescent current to 3.0mA typically and adds a switchless active bypass mode for higher PAE at low output power levels. High efficiency at low power output has become an important design parameter for handset manufacturers since in urban and suburban areas with good cellular coverage handsets usually transmit at low power. The PAMs feature PAE of 12%-20% of maximum output power in bypass mode and 20%-25% of maximum output power in mid-power mode, representing improvements over existing power amplifiers in the market. CoolPAM technology enables mobile handset designers to extend the usage time without an increase of battery capacity.
All ACPM500x and the ACPM-520x UMTS power amplifiers include a 20dB directional coupler. The high directivity makes precise power control possible. For multi-band handsets, the internal directional coupling and isolation ports are available for daisy chaining. This simplifies system printed circuit board layout.
The new power amplifiers are manufactured on InGaP HBT (hetero-junction Bipolar Transistor) MMIC (microwave monolithic integrated circuit) technology with proven state-of-the-art reliability, temperature stability and ruggedness.
The ACPM-500x power amplifiers series targets all OEMs and ODMS in the UMTS, CDMA and LTE handset and data card markets. The PAMs are available in a compact 10-pin surface mount module with a 3mm by 3mm footprint. Thin package heights (0.9mm typical for the ACPM-500x and 1mm typical for the ACPM-520x) support slim handset designs. The devices are lead-free and RoHS compliant. All devices have a -20°C to +85°C case operating temperature range.
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