MCUs for patient care
08 November 2010
Package technology realises miniaturisation at the bare chip level.
Renesas Electronics Corporation has announced the successful development of a new ultra-compact microchip package technology for use in microcontroller unit (MCU) products.
The newly developed technology is a kind of IC packaging technology that employs wafer-level redistribution technology, called the FO-WLP (Fan-Out Wafer-Level Package) technology, which makes it ideal for ultra-compact MCU products. It uses multilayer interconnect technology and chip bonding technology; two elemental technologies from Renesas Electronics' SMAFTI (SMArt chip connection with Feed-Through Interposer) technology for 3D IC.
The FO-WLP production process consists of formation of redistribution layer (RDL) with copper pillar bumps (CPB) on a support wafer, high-speed chip-to-wafer bonding technology using chips with electroless plated pads, high-productive wafer-level mould underfilling technology for approximately 10µm gaps.
Using FO-WLP, Renesas Electronics has succeeded in packaging an 8bit MCU with a chip size of 1.6mm x 1.6mm in a package measuring 2.0mm x 2.0mm x 0.3mm; a reduction in volume of 80% from the previous package size of 3.0mm x 3.0mm x 0.7mm. The two-layer metal interconnects consist of polyimide and copper (Cu), the minimum wire width/space is 15µm/10µm, and the interlayer via size is 20µm.
Test results of the chip-RDL-board electrical connections show excellent reliability in a typical condition of 1,000 −40/+125°C temperature cycles.
FO-WLP technology can be used in a new SiWLP (System in Wafer-Level Package) that enables multiple chips, such as an MCU and an analogue/RF IC chip, to be arranged side by side with high-density interconnections between them. It makes possible greater miniaturisation and higher integration, allowing multiple chips to be contained in a SiWLP about the same size as a single chip.
With the rapid rise in awareness of energy and environmental issues in recent years, interest is focusing on more efficient use of energy through smart grids as well as environmental sensing and control technologies such as sensor networks. At the same time, sensing and feedback technologies used in patient monitoring systems are becoming increasingly important. SiWLP technology not only makes it possible to produce ultra-compact modules integrating MCUs and analogue devices, it also enhances affinity with the environment by combining sensors, actuators, and communication functions needed to implement an interface with the environment or the human body.
Renesas Electronics views the SiWLP technology as a cornerstone in support of advancement of these fields and plans to continue promoting R&D and product development.
Sample shipments of MCU products utilising FO-WLP are scheduled to begin in December 2011.
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