Miniature packaging for photocouplers
01 November 2011
High-speed photocouplers in ultra-miniature packaging offer guaranteed operation to 20Mbps.
Toshiba Electronics Europe (TEE) has expanded its family of extended temperature IC photocouplers with three new high-speed, low-power devices in miniature SO6 packaging.
Featuring typical data transfer rates of up to 20Mbps, the new ultra-miniature devices are guaranteed for operation at temperatures from -40ºC to 125ºC.
Toshiba’s new TLP2362, TLP2366 and TLP2368 logic IC couplers are suitable for high-speed communication interfaces in factory automation applications, industrial control systems, and measurement equipment.
The ICs feature single inverter logic outputs and allow designers to comply with reinforced insulation requirements in accordance with EN60747-5-2 and other international safety standards. Support for power supply voltages of between 2.7 V and 5.5 V ensures compatibility with existing and new designs as well as providing a migration path to lower voltage operation.
Both the 10Mbps TLP2362 and the 20Mbps TLP2368 have open collector outputs, while the 20Mbps TLP2366 has a totem-pole output, which enables sink and source drives. Minimum isolation voltage for all three products is 3750 Vrms and each is guaranteed for clearance distances in excess of 5mm.
As with other devices in Toshiba’s extended temperature photocoupler family, the TLP2362, TLP2366 and TLP2368 are built around GaAlAs LEDs that are optically coupled to high-gain, high-speed photodetectors. All offer very high input-to-output noise resistance, while internal Faraday shields ensure minimum common mode transient immunity of ±20kV/µs.
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