Event: Design for Manufacture
Date: 06 October 2010 to 07 October 2010
Type: Workshop
Location: Federicksburg, Virginia, USA
Description: Printed board design is about tough choices and trade-offs between increasingly sophisticated fabrication technologies.
This workshop will address tolerance characteristics that make sense using the capabilities of today’s manufacturing equipment. This is an opportunity to learn about design issues first-hand, with a tour of a printed board manufacturer.
It is a must for all involved directly in printed circuit board design. Recommended for: process, manufacturing, packaging, reliability and purchasing engineers, managers and staff.
Attendees will learn:
•Design parameters (rigid, flex & tolerances)
•Material selection (laminate & platings)
•Leaded parts vs. lead free
•Small hole technology (through-hole, blind, buried and microvias)
•Imaging, conductor definition, and lamination
•Solder mask and legend (plugged vias and surface finishes)
•Final fabrication and quality control (defect verification)
•Component requirements (new plating and size restrictions)
•Board design for assembly (components clearances and test nodes)
•Assembly material properties (new material impact on design)
•Land pattern design (mathematical models and library tools)
•Assembly considerations (new process restrictions on materials)
•Electrical testing (techniques and data transfer methods)
•Future changes contemplated for IC packaging
Two full days of instruction begin at 8:30 am and conclude by 5:00 pm, with a tour of Colonial Circuits' facility on 6 October. Lunches and refreshment breaks are included. Please note: Colonial Circuits is an ITAR-certified facility, and only US citizens may join the tour.
Organiser: IPC
Web site: http://www.ipc.org/IPCCalendar.aspx