A manufacturer of connectors and interconnect systems has a High Power Card Edge (HPCE) connector. This next generation power card edge connector from FCI is intended for applications demanding low power loss and high linear current density. The connector is rated to 9A per power contact beam (with multiple power contacts fully energised) without exceeding a 30°C temperature rise in still air. The HPCE connector has a low profile height (<= 7.50mm) and is based on...
Doing the conga
Congatec announces new COM Express small form factor module based on latest Intel Core i7 processor. The company has extended its COM Express product family with the highest performance module conga-BM57. It features the latest Intel Core i7-620M processor with a core speed of 2.66GHz, with 4MByte L2 cache and up to 8GByte fast (1066 MT/s) dual channel DDR3 memory. The conga-BM57 is a two chip solution which uses the Mobile Intel QM57 Express Chipset. The integrated graphics...
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